LTCC and HTCC Market Is Predicted To Reach USD 4,125.6 Million by 2030

[Pramod Kumar]

High-Temperature Co-Fired Ceramics (HTCC) and Low-Temperature Co-fired Ceramics (LTCC) applications fall under co-firing. The sintering temperature of LTCC is less than 900°C. This makes it possible to co-fire extremely conductive materials.

The temperature for HTCC is greater, at around 1,600°C. Further, HTCC components typically consist of numerous layers of alumina or zirconia metalized with tungsten, platinum, and molybdenum.

By 2030, it is predicted that the LTCC and HTCC market would reach USD 4,125.6 million from USD 2,919.0 million in 2022, according to P&S Intelligence. The widespread use of ceramic substrates in a variety of industries, including telecommunications, automotive, and consumer electronics, is what is causing the market to grow.

Additionally, the market for these items will increase due to the need for innovative, affordable tiny circuit boards for electrical components.

In the past years, LTCC accounted for over 70% of total revenue; it is expected that this category would continue to rule in the years to come. The preferred technology for high-frequency circuits is LTCC, which has a ceramic substrate. Excellent electrical characteristics enable limitless stacking.

Moreover, compared to HTCC, its mechanical qualities facilitate form-and-fit adaptability and outstanding mechanical performance in harsh settings.

Further, it is expected that there will be a rise in expenditures on wireless technologies and RF modules as a result of the increased need for high-speed internet in semi-urban and urban areas. These modules rely on LTCC products for consistent communication quality; hence, such expenditures foster the market's expansion.

Manufacturers of LTCC and HTCC are boosting their R&D spending in an effort to improve their manufacturing processes. For instance, the electronic devices group section of Kyocera Corporation spent USD 174.8 million on R&D, an increase of about 17% from 2020.